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| HD74HCT620/HD74HCT623 Octal Bus Transceivers (with inverted 3-state outputs)/ Octal Bus Transceivers (with 3-state outputs) Description This octal transceiver is designed for asynchronous two-way communication between data buses. The control function implementation allows for maximum flexibility in timng. This device allows data transmission from A bus to the B bus or from the B bus to the A bus depending upon the logic levels at the enable inputs (GBA and GAB). The enable inputs can be used to disable the device so that the buses are affectively isolated. The dual-enable configuration gives these devices the capability to store data by simultaneous enabling of GBA and GAB. Each output reinforces its input in this transceiver configuration. Thus, when both control inputs are enabled and all other data sources to the two sets of bus lines are at high impedance, both sets of bus lines (16 in all) will remain at their last states. The 8-bit codes appearing on the two sets of buses will be identical for the HD74HCT623 or complementary for the HD74HCT620. Features * * * * * * LSTTL Output Logic Level Compatibility as well as CMOS Output Compatibility High Speed Operation: tpd (Bus to Bus) = 15 ns typ (CL = 50 pF) High Output Current: Fanout of 15 LSTTL Loads Wide Operating Voltage: VCC = 4.5 to 5.5 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) HD74HCT620/HD74HCT623 Function Table Enable Input GBA L H H L GAB L H L H Operation HD74HCT620 B data to A bus A data to B bus Isolation B data to A bus, A data to B bus HD74HCT623 B data to A bus A data to B bus Isolation B data to A bus, A data to B bus Pin Arrangement Enable GAB A1 A2 A3 A4 A5 A6 A7 A8 1 2 3 4 5 6 7 8 9 20 VCC 19 Enable GBA 18 B1 17 B2 16 B3 15 B4 14 B5 13 B6 12 B7 11 B8 (Top view) GND 10 2 HD74HCT620/HD74HCT623 Block Diagram HD74HCT620 GAB GBA VCC A1 VCC B1 A2 A3 A4 A5 A6 A7 A8 B2 B3 B4 B5 B6 B7 B8 3 HD74HCT620/HD74HCT623 HD74HCT623 GAB GBA VCC A1 VCC B1 A2 A3 A4 A5 A6 A7 A8 B2 B3 B4 B5 B6 B7 B8 Absolute Maximum Ratings Item Supply voltage range Input voltage Output voltage DC current drain per pin DC current drain per VCC, GND DC input diode current DC output diode current Power dissipation per package Storage temperature Symbol VCC VIN VOUT I OUT I CC, I GND I IK I OK PT Tstg Rating -0.5 to +7.0 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 35 75 20 20 500 -65 to +150 Unit V V V mA mA mA mA mW C 4 HD74HCT620/HD74HCT623 DC Characteristics Ta = 25C Item Input voltage Symbol VIH VIL Output voltage VOH Ta = -40 to +85C Max -- 0.8 -- -- 0.1 0.33 5.0 1.0 40 A A A V Unit V V V Test Conditions VCC (V) 4.5 to 5.5 4.5 to 5.5 4.5 4.5 4.5 4.5 5.5 5.5 5.5 Vin = VIH or VIL I OH = -20 A I OH = -6 mA Vin = VIH or VIL I OL = 20 A I OL = 6 mA Vin = VIH or VIL, Vout = VCC or GND Vin = VCC or GND Vin = VCC or GND, Iout = 0 A Min Typ Max Min 2.0 -- 4.4 -- -- -- -- 2.0 0.8 -- -- -- 4.4 4.13 4.18 -- VOL -- -- Off-state output current Input current Quiescent supply current I OZ Iin I CC -- -- -- -- -- -- -- -- 0.1 -- 0.26 -- 0.5 -- 0.1 -- 4.0 -- AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Ta = 25C Item Symbol Ta = -40 to +85C Max 25 25 38 38 38 38 15 10 ns pF ns ns Unit ns Test Conditions VCC (V) 4.5 4.5 4.5 4.5 4.5 4.5 4.5 -- Min Typ Max Min -- -- -- -- -- -- -- -- 13 16 16 16 19 21 4 5 20 20 30 30 30 30 12 10 -- -- -- -- -- -- -- -- Propagation delay t PLH time Output enable time Output disable time Output rise/fall time Input capacitance t PHL t ZH t ZL t HZ t LZ t TLH t THL Cin 5 Unit: mm 24.50 25.40 Max 20 11 7.00 Max 6.30 1 0.89 1.27 Max 10 1.30 2.54 Min 5.08 Max 7.62 0.51 Min 2.54 0.25 0.48 0.10 0.25 - 0.05 0 - 15 + 0.11 Hitachi Code JEDEC EIAJ Weight (reference value) DP-20N -- Conforms 1.26 g Unit: mm 12.6 13 Max 20 11 1 10 5.5 0.80 Max 2.20 Max *0.22 0.05 0.20 0.04 0.20 7.80 + 0.30 - 1.15 0 - 8 0.70 0.20 1.27 *0.42 0.08 0.40 0.06 0.12 M *Dimension including the plating thickness Base material dimension 0.10 0.10 0.15 Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DA -- Conforms 0.31 g Unit: mm 12.8 13.2 Max 20 11 7.50 1 0.935 Max 10 2.65 Max *0.27 0.05 0.25 0.04 0.25 10.40 + 0.40 - 1.45 0.20 0.10 0 - 8 0.57 0.70 + 0.30 - 1.27 *0.42 0.08 0.40 0.06 0.15 0.12 M Hitachi Code JEDEC EIAJ Weight (reference value) FP-20DB Conforms -- 0.52 g *Dimension including the plating thickness Base material dimension Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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